Technical support for wafer heating

Sun, 28 Jun 2026 01:50:08 +0800

On the fab floor, the bake step is where yield lives or dies. A 2°C swing in soft bake or hard bake will move your critical dimensions, and one particle kicked up during heating can take out a die. We built the wafer heating support to knock that variability out of the equation. What matters, technically We hold wafer-level thermal uniformity at ±0.1°C across the substrate, so every site gets the same thermal budget. It runs in Class 1–100 cleanrooms without pushing particle counts, and at the point of heat it generates zero particles. Temperature repeatability stays within ±0.2°C shot-to-shot, which keeps the lithography stack predictable. The design uses short-wave infrared elements for fast, controllable ramp rates, and the hot zone is built for low outgassing so photoresist integrity stays intact. Here’s why it works in lithography. Soft bake is about solvent removal and managing film stress; hard bake sets adhesion and etch resistance. Tight control on both translates straight into stable CDs, fewer defects, and higher first-pass yield. You get faster recipe cycles without overshoot, lower energy use thanks to efficient thermal coupling, and fewer maintenance interruptions—our units have run 5,000+ hours with less than 5% output drop. The payoff is consistent line-width control and less scrap. A few practical notes. Installation means matching the thermal profile to your specific coater/track chamber geometry and confirming exhaust and coolant compatibility. Expect a short commissioning period to dial in ramp rate and overshoot for your resist stack. Once aligned, the system handles 24/7 operation, but keep cleanroom airflow stable—shifts in laminar flow can introduce minor drift at the wafer edge.

Support on Cozy Corner Infrared Heating

Technical support for wafer heating